3D visualization enhances chip design with NVIDIA technology, improving speed and reliability

From Nvidia: 2024-06-24 15:00:44

Multi-die chips, or 3D-ICs, are stacked vertically to improve performance without using more power. Ansys uses NVIDIA technology at the Design Automation Conference to tackle electromagnetic and thermal challenges in semiconductor design. They employ NVIDIA Omniverse for 3D visualizations, enabling engineers to optimize chips for speed and reliability through simulations. By utilizing NVIDIA Modulus and AI surrogate models, Ansys aims to accelerate simulation workflows and explore a wider design space for new chips. Ansys plans to integrate AI surrogate models into their RedHawk-SC platform for faster simulation workflows and enhanced design space exploration. Visit Ansys at the Design Automation Conference to see their joint demonstration of 3D-IC multiphysics visualization using NVIDIA Omniverse APIs or watch the presentation at the Exhibitor Forum.



Read more at Nvidia: Why 3D Visualization Holds Key to Future Chip Designs