Outsourced Semiconductor Assembly and Test (OSAT) market expected to reach USD 77.90 billion by 2032.
From GlobeNewswire: 2024-11-06 09:06:00
The Outsourced Semiconductor Assembly and Test (OSAT) Services Market was valued at USD 40.10 Billion in 2023 and is projected to reach USD 77.90 Billion by 2032, with a CAGR of 7.67% over 2024-2032. Innovation and strategic shifts are driving growth in the OSAT market as demand dynamics evolve, with Taiwan, China, and the U.S. dominating the global landscape.
In 2023, the OSAT sector faced challenges due to decreased consumer electronics demand and a decline in non-AI cloud server demand. Capacity utilization across OSAT plants averaged 65% in the first half of 2023, rising to 75% later. Advancements in packaging technologies like 3D packaging and system-in-package are set to enhance thermal management and functionality, supporting renewed market growth into 2024.
The assembly and packaging segment led the OSAT market in 2023 with an 85% share, driven by the need for advanced packaging solutions for semiconductor designs. The testing segment is projected to be the fastest-growing from 2024 to 2032, as demand for quality control accelerates testing services.
In 2023, the telecommunications sector dominated the OSAT market with a 36% share, driven by demand for advanced communication technologies. Consumer electronics are set to be the fastest-growing segment from 2024 to 2032, fueled by smart device demand and rapid innovation in semiconductor packaging and testing.
The Asia Pacific region dominated the OSAT market in 2023 with a 55% market share, driven by leading semiconductor manufacturers and assembly houses. Countries like China, Taiwan, and South Korea attract investments in OSAT services. North America is poised to become the fastest-growing region from 2024 to 2032, driven by demand for advanced semiconductor solutions. Major semiconductor firms like Amkor Technology and Jabil are investing in new assembly technologies to meet industry demands. Amkor Technology partnered with TSMC to open an OSAT facility in Arizona, while ASE Group expanded capacity in Malaysia and China. SPIL also launched a new facility in Taiwan focusing on advanced packaging technologies.
The Outsourced Semiconductor Assembly and Test Services Market report includes in-depth analysis, statistics, and trends. It covers customer demographics, capacity utilization rates, service delivery times, and customer retention rates. The report also features a competitive landscape, market segmentation by service type and region, company profiles, and use cases.
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