Micron Breaks Ground on New HBM Advanced Packaging Facility
From GlobeNewswire: 2025-01-07 21:00:00
Micron Technology broke ground on a new High-Bandwidth Memory facility in Singapore, the first of its kind in the country. Operations to begin in 2026 to meet AI demands, with a $7 billion investment creating 1,400 jobs initially. Expansion plans to reach 3,000 jobs in the future. The facility aligns with Micron’s sustainability commitments and will feature advanced technologies. Singapore Economic Development Board welcomes Micron’s investment, strengthening the semiconductor ecosystem. Micron’s future expansion in Singapore will also support long-term manufacturing requirements for NAND. The facility will be highly automated and designed for LEED certification.
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