From GlobeNewswire: 2025-05-14 02:00:00

The 3D IC and 2.5D IC Packaging Market was valued at USD 51.81 billion in 2023 and is expected to reach USD 120.66 billion by 2032, growing at a CAGR of 9.88% driven by performance demands and integration needs. Leading market players include TSMC, Intel, Samsung Electronics, and more. The U.S. market is estimated to be USD 11.13 billion in 2023, projected to grow at a CAGR of 9.74%.

The shift towards modular architecture and heterogeneous integration is gaining traction, enabling the combination of multiple chipsets in a single package to reduce cost, power, and space. The market growth is fueled by advancements in technology like AI, HPC, and 5G. The U.S. market is further bolstered by initiatives like the CHIPS Act and continued innovation by companies like Intel.

In 2023, 3D wafer-level chip-scale packaging (WLCSP) dominated the market share due to its use in consumer electronics. The 3D Through-Silicon Via (TSV) segment is projected to register the highest CAGR from 2024 to 2032. The Memory segment held a significant share in 2023 due to the demand for high-bandwidth memory technologies.

The Asia Pacific region led the 3D IC and 2.5D IC Packaging market in 2023 and is projected to grow at the highest CAGR through 2032. Strong demand from consumer electronics, automotive, and AI computing industries is driving R&D and capex in the region. Government programs like China’s “Made in China 2025” are also contributing to market growth.

In May 2025, Synopsys enhanced its 3DIO solution for multi-die integration, delivering increased modularity, yield, and scalability for more efficient heterogeneous SoC designs. The market report covers key segments, market size, competitive landscape, and regional analysis, providing insights into the growth drivers across different technologies, applications, and end users.



Read more at GlobeNewswire: 3D IC and 2.5D IC Packaging Market to Worth USD 120.66