GlobalFoundries partners with A*STAR to enhance packaging capabilities for AI applications in Singapore
From Yahoo Finance: 2025-05-21 12:15:00
Globalfoundries Inc. has partnered with Singapore’s A*STAR to enhance its advanced packaging capabilities for AI and data-intensive applications. This collaboration will focus on developing energy-efficient semiconductors tailored for artificial intelligence, solidifying Globalfoundries’ position as a one-stop shop for manufacturing, processing, and testing semiconductor chips in Singapore.
The partnership with A*STAR builds on plans to establish an Advanced Packaging and Photonics Center for US-made chips, marking a significant milestone in Globalfoundries’ efforts to enhance packaging offerings and improve its position in the semiconductor value chain.
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Read more: GlobalFoundries Inks Deal to Enhance Advanced Packaging Capabilities In Singapore