From GlobeNewswire: 2025-05-30 09:00:00

The High Density Interconnect Market was valued at USD 12.81 billion in 2023 and is projected to reach USD 26.72 billion by 2032, with a CAGR of 8.55% over the forecast period. Growth is driven by demand for handheld devices, 5G infrastructure development, AI hardware, and edge computing.

The U.S. High Density Interconnect Market is expected to grow from USD 2.44 billion in 2023 to USD 3.86 billion by 2027, at a CAGR of 8.22%. Asia Pacific leads the global HDI market with 35.3% of revenue in 2023, driven by a strong electronic manufacturing ecosystem and demand for sophisticated HDI technology.

In 2023, the 4–6 layers HDI segment dominated the market with 46.3% share, used in high-end consumer electronics like smartphones and tablets. Communication devices & equipment accounted for 33.1% of the market, while consumer electronics held a 38.4% share, driven by demand for space-saving, high-performance devices.

Leading market players in the High Density Interconnect Market include TTM Technologies, Unimicron Technology Corporation, AT&S, Samsung Electro-Mechanics, and more. Recent developments include TTM Technologies expanding its facility for advanced chip packaging, and Samsung, SK, and LG competing in the glass substrate market.

For more information on the High Density Interconnect Market, including market size, segments, competitive landscape, and regional analysis, visit https://www.snsinsider.com/checkout/6676.



Read more at GlobeNewswire: High Density Interconnect Market to Reach USD 26.72 Billion