From GlobeNewswire: 2025-05-26 09:00:00

The Panel Level Packaging Market was valued at $2.18 billion in 2024 and is projected to reach $3.41 billion by 2032, with a CAGR of 5.77%. This growth is driven by the demand for high-performance semiconductor devices in applications like AI, 5G, automotive electronics, and more.

The U.S. PLP market is expected to reach $0.33 billion by 2024, with a CAGR of 6.41%, fueled by high-performance computing, IoT, and medical electronics. PLP offers a cost-effective, power-efficient solution for embedding multiple dies and chips in a single panel.

Fan-out Wafer-Level Packaging (FOWLP) dominated the market in 2024, while Panel-Level Packaging (PLP) is forecasted to be the fastest-growing technology from 2025 to 2032. Rigid Carriers held the largest market share in 2024, with Composite Carriers expected to grow the fastest.

In 2024, consumer electronics led the PLP market, with automotive electronics expected to grow the fastest from 2025 to 2032. Asia Pacific dominated the market in 2024, with North America poised for rapid growth from 2025 to 2032. Europe, Latin America, and the Middle East & Africa show potential for future growth.

Recent developments include ASE Technology Holdings and PTI investing in FOPLP, and Samsung focusing on plastic panels for FOPLP. TSMC is promoting a glass panel design for better performance. The market dynamics are analyzed in the report, highlighting key trends and insights for industry players.

SNS Insider offers detailed reports on the Panel Level Packaging Market, covering market size, key segmentation, competitive landscape, regional analysis, and more. The company aims to provide clients with accurate market data and insights to make informed decisions in a rapidly changing market landscape.



Read more at GlobeNewswire: Panel Level Packaging Market Size to Hit USD 3.41 Billion