From Yahoo Finance: 2025-06-12 01:27:00

Besi Semiconductor Industries raises long-term financial targets ahead of investor day, expects increased demand for advanced chip stacking tools. Nvidia, Broadcom, Intel, and AMD looking to adopt hybrid bonding technology, potentially boosting Besi’s tool sales. Revenue forecast increased to 1.5-1.9 billion euros with an operating margin of 40-55%. Chipmakers turning to advanced packaging like hybrid bonding for faster, more powerful chips as physical limits of shrinking chip features are reached. Besi equipment seen as crucial for leading-edge chipmakers, but analysts cautious about raised targets. Besi shares up 8.4% but down 3.2% for the year.



Read more at Yahoo Finance: Besi lifts long-term targets, expecting new AI customers