Marvell Technology is advancing its semiconductor technology with innovations like gate-all-around transistors and backside power delivery. The company is leveraging advanced packaging solutions like Chip-on-Wafer-on-Substrate and Integrated Fan-Out methods for high-performance compute ASICs.

Marvell Technology’s modular redistribution layer (RDL) interposer technology allows for the development of multi-die AI accelerator solutions with improved efficiency. This technology is expected to drive growth in the data center semiconductor market, with an anticipated total addressable market of $94 billion by 2028.

Broadcom and AMD are also key players in the custom silicon space for AI accelerators, but Marvell Technology’s focus on 2.5D packaging and RDL interposer technology positions it as a leader in the industry. Marvell Technology’s stock performance has lagged this year, but its forward price-to-sales ratio is lower than the industry average.

Marvell Technology’s stock has declined this year, but its forward price-to-sales ratio is lower than the industry average. Analysts expect strong earnings growth for the company in fiscal 2026 and 2027, with estimates revised upward in the past seven days. The company currently holds a Zacks Rank #3 (Hold).

For investors looking for breakout stocks, Marvell Technology’s advancements in semiconductor technology make it a compelling choice. Download the free Special Report on the 7 Best Stocks for the Next 30 Days to learn more about potential opportunities in the market.

Read more at Nasdaq: MRVL’s Modular Packaging Tech: Can it Transform AI Accelerators?