Microsoft successfully tested a new microfluidic cooling system for data centers, removing heat up to three times better than current methods. The technology leverages AI to map heat signatures on chips and improve cooling efficiency. This advancement is expected to enhance power usage effectiveness and reduce operational costs.

Microfluidics allow liquid coolant to flow directly inside the silicon chip, removing heat more effectively through tiny channels etched on the chip’s back. Microsoft aims to incorporate this technology into future chip designs to enhance features, performance, and space efficiency. Collaboration with partners will bring microfluidics into production across data centers.

Read more at Yahoo Finance: Microsoft (MSFT) Unveils Microfluidic Cooling Technology for Data Centers