SK Hynix completes certification for next-gen HBM4 chips, aims for mass production by second half of the year. HBM technology stacks chips vertically to save space and reduce power consumption for AI applications. Analyst projects SK Hynix to maintain 60% market share in 2026. Company’s shares close at record high.

Samsung Electronics aims to catch up in HBM technology with more advanced node. Company provides samples of HBM4 chips to customers, plans to supply next year. SK Hynix executive notes technological changes in building next-gen HBM4 chips include customer-specific logic die. Shares of SK Hynix up 88.9% this year, outpacing Samsung and Micron.

Read more at Yahoo Finance: SK Hynix says readying HBM4 production as it seeks to retain lead over rivals