STMicroelectronics N.V. will develop next-gen Panel-Level Packaging technology in France with a $60 million investment, operational by Q3 2026. The company’s reshaping manufacturing footprint program includes advanced infrastructure development in France and Italy. Panel-Level Packaging with Direct Copper Interconnect improves electrical performance and heat dissipation. The PLP-DCI line in Malaysia produces over 5 million units daily. The project will benefit from local R&D ecosystem synergies. Panel-Level Packaging enhances efficiency, reduces costs, and enables smaller, more powerful devices. STMicroelectronics stock traded 0.04% lower at $27.23 on the NYSE.

Read more at Nasdaq: STMicroelectronics To Invest $60 Mln In France Pilot Line For Next-gen Chip Packaging