ACM Research, Inc. has introduced the Ultra ECP ap-p, a panel electrochemical plating tool, meeting the demand for advanced packaging solutions. This system supports plating steps for copper deposition in large-panel markets, achieving performance comparable to traditional round wafer processes. The technology includes chambers for copper, nickel, tin-silver, and gold plating, with features like high-speed plating paddles and a four-sided sealing dry contact chuck for reliability. ACM aims to accelerate the industry’s transition to panel-level packaging to meet the needs of next-generation devices efficiently.

The Ultra ECP ap-p platform offers high-performance horizontal panel electroplating solutions to help customers advance their packaging roadmaps. With a focus on scalability, throughput, and cost advantages, this system supports the industry’s shift from 300-millimeter wafer packaging to panel-level packaging for high-volume production. ACM’s technology includes proprietary horizontal electroplating and synchronized rotating square electrical fields for superior deposition uniformity.

ACM Research, Inc. is a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications. They aim to deliver high-performance, cost-effective process solutions to semiconductor manufacturers to enhance productivity and product yield. The company’s focus on customized tools for semiconductor device manufacturing highlights their commitment to meeting evolving industry needs efficiently.

Read more at GlobeNewswire: ACM Research Delivers First Horizontal Panel Electroplating