From GlobeNewswire: 2025-05-06 09:21:00

The Hermetic Packaging Market is projected to reach USD 7.36 billion by 2032, with a CAGR of 7.49% from 2024. Industries like aerospace, defense, automotive, and healthcare are driving the demand for high-reliability electronic components. Leading players in the market include NGK Spark Plug Co., Schott AG, and AMETEK, Inc. Ceramic-to-metal sealing dominates the market, with the Military & Defense segment leading in applications. Asia-Pacific and North America are key regions driving growth.
Innovations in materials and miniaturization are enhancing packaging performance while maintaining safety, reliability, and environmental compliance. The market is expected to grow significantly in the U.S., fueled by stringent regulatory requirements in defense and space industries. Key players in the market include NGK Spark Plug Co., Ltd., Schott AG, and AMETEK, Inc., among others. Ceramic-to-metal sealing dominates the market, with the Military & Defense segment leading in applications.
The Asia-Pacific region dominated the hermetic packaging market in 2023, accounting for around 40% of total revenue. Countries like China, Japan, South Korea, and India are leading advancements in 5G infrastructure, EVs, and space exploration, driving demand for hermetically sealed components. North America is expected to remain a major player in the market, driven by strong aerospace, defense, and medical sectors.
Recent developments in the hermetic packaging market include testing a new air-cavity liquid crystal polymer packaging solution, discussing the role of epoxy adhesives in micro-scale battery design, and addressing challenges in ceramic packaging with proprietary plated copper on thick film technology. The market report includes a detailed analysis of market dynamics, segmentation by product and application, regional analysis, and company profiles.
SNS Insider is a leading market research agency providing clients with current, accurate market data, consumer insights, and opinions to make informed decisions. Related reports include analysis of the electronic packaging industry, semiconductor packaging industry, interposer and fan-out wafer level packaging industry, 3D IC and 2.5D IC packaging industry, and semiconductor assembly and packaging services industry.



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