Cisco Systems, Inc. (CSCO) unveiled the Silicon One G300 chip targeting a $600 billion AI infrastructure opportunity. The chip, set to launch in the second half of the year, aims to accelerate data movement in large data centers and improve communication between processors for AI systems.

Manufactured using Taiwan Semiconductor Manufacturing Co.’s 3-nanometer process technology, the Silicon One G300 chip includes new features to prevent slowdowns during data traffic spikes. Cisco expects the chip to enhance AI computing tasks by 28% and automatically reroute data to improve network efficiency.

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Read more at Yahoo Finance: Cisco Systems, Inc. (CSCO) Unveils Silicon One G300 Chip to Target $600B AI Infrastructure Opportunity